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Embedded Systems

MX1-10FEP

Coffee Lake Xeon / Core-i Processor
Rugged Fanless Embedded System
6 USB, 2-6 Serial, 3-7 LAN, 1 HDMI, 1 DP, 1 DVI, Expansion Module, SIM

DIMENSIONS

268.0 x
246.0

PROCESSOR

Intel Xeon

PROCESSOR GENERATION

N/A (SoC)
Download Datasheet

FULL DETAILS

Specifications

SKU

MX1-10FEP

Dimensions

268.0 x
246.0

Processor

Intel® C246 Chipset:; 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W; 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max 35W

Processor Socket Type

LGA1151

Processor Generation

N/A (SoC)

Chipset

Intel® C246 Chipset

Graphics

Intel® HD Graphics

Memory Type

DDR4

Memory Capacity

Up to Max. 32GB

Memory Speed

2666

Memory Slots

2x
SO-DIMM

LAN Controller

Intel® I219-LM Giga LAN + I210-IT Giga LAN

Front I/O

2 x USB 3.0
1 x HDMI 1.4
2 x SIM Card Slot w/ Cover
1 x 2.5″ SATAIII HDD / SSD Bay

Rear I/O

4 x USB 3.1 Gen 2 (Gbps)
2 x USB 2.0
2 x RJ-45
1 x DisplayPort 1.2,
1 x DVI-I
1 x PS/2
2 x RS232 / 422 / 485 (Support Power 5V / 12V), 1 x Mic-in, 1 x Line-out
1 x 2-pin Terminal Block Remote Power on / off
1 x 2-pin Terminal Block Remote Power reset
1 x 4-pin Terminal Block External Fan Connector
1 x 3-pin Terminal Block Power Input
4 x SMA Antenna (Optional for WiFi/LTE function)

Storage

3 x 2.5 HDD / SSD (1 w/ Removable HDD Bay, 2 w/ Internal HDD Bracket)
2 x mSATA

Expansion

Storage: Mini PCIe Full size (USB / PCIe / SATA)
LTE/Wireless: Mini PCIe Full size (USB / PCIe), w/ SIM Card Holder (w/ Full to Half size adapter plate)
Xpansion Modules include options for: Up to 12 LAN, 10 PoE, 10 COM, 16 DIO, Power ignition Function

Operating Temp

-40.0 ~
70.0

Input Voltage

9~48V Wide Rage DC Input w/ Terminal Block Connectivity

Certifications

Other (EMC: CE & FCC; Safety: compliant with LVD; EN60950-1 / EN62368-1; Compliant with EN50155/EN50121/E-mark)

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