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Embedded Systems

ED700

Intel® Atom® Processors X Series
Compact Fanless Embedded System
4 USB 3.1, 2 x USB 2.0, 1 x 2.5GbE TSN , 2 x GbE LAN, 2 COM

DIMENSIONS

172.0 x
118.0

PROCESSOR

Intel Atom

PROCESSOR GENERATION

N/A (SoC)
Download Datasheet

FULL DETAILS

Specifications

SKU

ED700

Dimensions

172.0 x
118.0

Processor

Intel® Atom® Processors X Series, BGA 1493; Intel PC Client Series; Intel® Celeron® J6412 4 cores, 2.0 to 2.6 GHz, TDP 10W; Intel® Celeron® J6413 4 cores, 1.8 to 3.0 GHz, TDP 10W; Intel® Embedded Series; Intel® Atom® x6211E 2 cores, 1.3 to 3.0 GHz, TDP 6.5W; Intel® Atom® x6413E 4 cores, 1.5 to 3.0 GHz, TDP 9W; Intel® Atom® x6425E 4 cores, 2.0 to 3.0 GHz, TDP 12W; Intel® Atom® x6425RE 4 cores, 1.9 GHz, TDP 12W

Processor Socket Type

BGA 1493

Processor Generation

N/A (SoC)

Chipset

SoC Integrated

Graphics

Intel® UHD Graphics for 10th Gen Intel® Processors; OpenGL 4.5, DirectX 12, Open CL 1.2, Vulkan 1.1; HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9; HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9

Memory Type

DDR4

Memory Capacity

Up to up to 32GB

Memory Speed

3200

Memory Slots

0 (Onboard)x
SO-DIMM

LAN Controller

2 or 3 x Intel® Ethernet Controller I210/I211 GigE LAN
1 x Intel® Ethernet 2.5GigE LAN

Front I/O

2 or 3 x GbE (RJ-45) (configuration options)
1 x 2.5GbE TSN RJ45
1 x Allxon OOB Enabler (by request)
2 x RS232/422/485
2 or 4 x USB 3.1 (configuration options)
1 x VGA;

Rear I/O

TOP:2 x USB 2.0
4 x antenna opening for 4G/5G/GPS
Dual SIM

Storage

1 x M.2 2280 (SATA)
eMMC eMMC 16GB/32GB

Expansion

1 x M.2 2230 (USB/PCIe)
1 x M.2 3042/3052 (USB 3.0/PCIe) with dual SIM

Operating Temp

0.0 ~
60.0

Input Voltage

Wide range 9~36V

Certifications

CE
FCC
RoHS
Other (Shock: Operating: 3G; 11ms; Shock: Non-Operating: 5G; 11ms; Vibration: Operating: Random 5~500Hz; IEC68-2-64 (3G); Vibration: Non-Operating: Sine 10~500Hz; IEC68-2-6 (3G))

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Need the ED700 configured for your application?

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